About us_Venlinktech Microelectronics. All Rights Reserved

Company Profile

VELINKTECH, was founded in March 2021. It is a company dedicated to the design of ultra-high-speed transmission and network communication chips for in-vehicle networks (IVN). Its products are mainly applied in automotive, industrial, and consumer markets, covering both traditional and emerging sectors. All of the company’s core team members come from internationally renowned semiconductor companies, with an average industry experience of over 20 years. VELINKTECH is one of the world’s rare teams with forward-looking R&D capabilities in automotive ultra-high-speed SerDes/PHY. The team’s expertise spans the entire field of communications and high-speed interfaces, including scarce technologies in high-speed and high-precision digital model. VELINKTECH has branches in Changzhou, Shanghai, and the United States. Anchored in providing customers with chip products that support the international standard MIPI A-PHY (IEEE 2977-2021) and HSMT of Dual-protocol vehicle, and automotive Ethernet chip products based on IEEE 802.3.

Development path

History

2025

2025.04 · Public demonstration of 8Gb/s PAM4 image transmission at Auto Shanghai
2025.04 · Release of dual-mode A-PHY/HSMT chip
2025.04 · Release of ISP/A-PHY integrated solution
2025.07 · Mass production launch with Geely Lynk & Co 06 model
2025.07 · Release of HSMT 12.8Gb/s PAM4 product

2024

2024.04 · First public demonstration of 4Gb/s solution at Auto China (Beijing)
2024.04 · Engineering samples delivered
2024.05 · Passed electromagnetic compatibility (EMC) testing
2024.07 · Successful full-function 8Gb/s PAM4 image transmission
2024.09 · Successful interoperability with competitor’s A-PHY chip
2024.11 · Joined A-PHY standardization working group
2024.12 · Mass production of 2G/4G products

2023

2023.11 · Series C financing completed
2023.12 · Obtained ISO 26262 / ISO 9001 certifications

2022

2022.04 · Successful test of full-duplex transceiver front-end
2022.11 · Successful full-function 4Gb/s image transmission

2021

2021.03 · Seed round financing completed
2021.07 · Successful test of downlink transceiver front-end
2021.11 · Series B financing completed

2020

2020.05 · Company registered (Shanghai & Dallas)